MicroClean™ S
MicroClean S is a low foam cleaner for removing fingerprints, chromate and oxide residues from copper and other metal foils prior to photoresist lamination or oxide.
Download Data Sheets
Download Data Sheets
MicroClean S is a low foam cleaner for removing fingerprints, chromate and oxide residues from copper and other metal foils prior to photoresist lamination or oxide.
A chloride-organic acid activated flux designed for maximum performance in vertical hot air leveling machines, where a lower viscosity flux is desired for complete wetting of small holes and surface mount pads. FLO RITE LV provides excellent wetting and even coverage, resulting in a superior solder finish.
Defoamer FETM is a fully organic non-Silicone water-soluble defoamer that rinses readily and leaves no residue. It is designed for systems where clean rinsing is essential. It is odorfree and biodegradable. Defoamer FETM is ideal for defoaming developers or strippers of any type and will work at any pH.
An acidic, solvent-based, soluble equipment cleaner designed for use on photoresist developers and strippers. E-cleanDF is exceptionally effective on dry film resists, antifoam residues, hard water scale and carbonate residues. It effectively cleans the residues inside nozzles and pipes.
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