Aqua Flo
An organic, water soluble fusing fluid custom blended for use in tin/lead infrared fusing equipment. AQUA FLOcontains activators which clean exposed copper, providing excellent edge coverage.
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PreLam™ Cleaner S
PreLam Cleaner is a cleaner/microetch/adhesion promoter for use on copper and other metals. It will give optimal resist adhesion both initially and during subsequent processing, where other chemicals can weaken the bond at the copper/photoresist interface. PreLam Cleaner S yields a non-traditional looking panel with a bright orange color rather than a more typical matte pink.
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ADF-25
Formulated for outstanding performance on today’s newest dry film resists in spray or soak applications. ADF-25breaks dry films into particles suitable for filtration. It also protects the panels from staining caused by dyes in the photoresist. ADF-25demonstrates consistently high loading capabilities, and contains an enhanced copper brightening and antitarnish package. This enables it to produce a bright, uniform copper surface for automatic optical inspection and better etching characteristics.
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DX™40
A one-part concentrate (40% potassium carbonate) formulated to develop fully aqueous dry film photoresists. DX-40 is economical to use and easy to handle, eliminating the need to weigh and dissolve powdered materials. It contains a unique blend of ingredients to enhance the loading capacity of the solution and help keep the equipment clean. These special ingredients help ensure straight sidewalls and will help clean the foot” of underdeveloped polymer. These features result in greater productivity and less down time. DX-40 also works well for developing aqueous photoimageable solder masks or for any other situation where carbonate is used. “” one-part concentrate (40% potassium carbonate) formulated to develop fully aqueous dry film photoresists. DX-40 is economical to use and easy to handle
