MicroClean™ CuL
MicroClean CuL is a micro-cleaner that is designed to remove extremely tenacious soils from copper
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Download Data Sheets
MicroClean CuL is a micro-cleaner that is designed to remove extremely tenacious soils from copper
MicroClean™ CM is a “micro-cleaner” that is designed to remove extremely tenacious soils from copper, iron, iron-nickel and iron-nickel-chrome alloys. MicroClean™ CM was created to meet the needs of the Chemical Milling Industry. It can remove even baked-on organic compounds, such as may be found on sheets of Alloy 42, stainless steels or copper as they are received or after stripping baked-on photoresist.
VersaPrep is formulated to microetch multiple metallic surfaces and thus improve their processing including lamination, imaging and solder mask application. Microetching results in surfaces that are cleaner, with removed or reduced oxide and with higher roughness. These mechanisms occur to a different extent on different metals. VersaPrep is effective on aluminum, stainless steel, copper, copper alloys and selected other alloys such as Inconel. Different substrates can be treated with simple adjustments of concentration, temperature and contact time. VersaPrep can be used in either spray or soak mode.
Ferric Cleaner removes water hardness, photoresist scum and metal salt deposits from chemical processing equipment. Specifically developed for the chemical milling industry it is very useful in spray equipment causing no damage to metal and plastic parts. It can be applied in ferric etchers, dry film developers, strippers and cleaner equipment modules.
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