In-Process Defoamer™
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FlexClean DM™
FlexClean DM is a powerful, non-foaming and free rinsing alkaline cleaner specifically formulated to clean copper on exposed alkalisensitive substrates including polyimide. It will remove oven baked residues, oxidation, fingerprints and oils, all without attack of alkali sensitive substrates or removal of any copper metal. Use of FlexClean DM will leave the copper surface bright, oxidation-free and ready for photoresist application or oxide process. FlexClean DM may be used in conjunction with an acid cleaner, or if required, a light microetch. If a microetch is used, much lower levels of metal are fully acceptable thus minimizing costs and reject rate.
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ADF-35
Formulated to remove fully aqueous dry films and screen ink resists from inner layers in spray applications. ADF-35will produce large particles for easy filtration, with less dissolved resist for prolonged bath life. It contains antitarnish agents to maintain a bright uniform copper appearance. It has very low levels of ingredients classified as VOCs, and when used as directed is exempt from SCAQMDregulation.
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Flexstrip
An aqueous photoresist stripper specifically formulated for flexible circuit stripping operations. FLEXSTRIPcontains copper antitarnish agents providing a cleaner surface for subsequent flex material processing. FLEXSTRIPproduces fast strip speeds while producing large particles suitable for filtration. It contains no glycol ether solvents for greater compatibility with flex materials and a safer working environment.
