In-Process Defoamer™
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Ultrastrip BAT
A highly concentrated, long lasting, high performance non-caustic stripper for removal of aqueous dry film photoresists. It can be used on both inner and outer layers and produces large particles suitable for filtration. ULTRASTRIP contains copper brightening agents to provide a bright, uniform surface. It contains NO glycol ether solvents for a safer working environment.ULTRASTRIP BAT contains antitarnish agents which preserve the copper surface for automatic optical inspection and better etching characteristics.
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Sur Clean™ 92
An acid, sprayable cleaner and microetch. SUR CLEAN 92 removes a minute portion of metallic copper in addition to oxides and organic contamination. It can be used for cleaning inner layers, prior to solder mask application for SMOBC, and prior to solder leveling. It is effective in both spray and soak applications.
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PreLam™ Cleaner
PreLam Cleaner is a cleaner/microetch/adhesion promoter for use on copper and other metals. It will give optimal resist adhesion both initially and during subsequent processing, where other chemicals can weaken the bond at the copper/photoresist interface. PreLam Cleaner yields a non-traditional looking panel with a bright orange color rather than a more typical matte pink.
