PreLam Cleaner is a cleaner/microetch/adhesion promoter for use on copper and other metals. It will give optimal resist adhesion both initially and during subsequent processing, where other chemicals can weaken the bond at the copper/photoresist interface. PreLam Cleaner S yields a non-traditional looking panel with a bright orange color rather than a more typical matte pink.
Low acid activator system used to catalyze non-metallic surfaces for the subsequent metallization by electroless copper. CIRCUTEK C-777is primarily used in the fabrication of printed circuit boards but can also be used in any application where the metallization of a non-conductor is desired.A pre-dip solution is necessary to pre condition the substrate and to minimize drag-in of water into the CIRCUTEK C-777. Make up the pre-dip solution according to instructions below, or use CIRCUITEK PD-776 liquid.CIRCUTEK PD-776Sis also used in the preparation of CIRCUTEK C-777.
A one-part concentrate (40% potassium carbonate) formulated to develop fully aqueous dry film photoresists. DX-40 is economical to use and easy to handle, eliminating the need to weigh and dissolve powdered materials. It contains a unique blend of ingredients to enhance the loading capacity of the solution and help keep the equipment clean. These special ingredients help ensure straight sidewalls and will help clean the foot” of underdeveloped polymer. These features result in greater productivity and less down time. DX-40 also works well for developing aqueous photoimageable solder masks or for any other situation where carbonate is used. “” one-part concentrate (40% potassium carbonate) formulated to develop fully aqueous dry film photoresists. DX-40 is economical to use and easy to handle
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