Circutek EC-807
Circutek EC-807 is an electroless copper designed for high performance PTH metallization in the PCB industry. The EC-807 bath is self-accelerating and yields a smooth deposit of uniform color and low stress. The controls are simple producing consistent plating results and excellent chemical stability.
Download Data Sheets
Related products
-
EV Screen Cleaner™
A wipe-off screen cleaner formulated to rapidly remove inks from printed circuit screens and boards without leaving a residue. EV SCREEN CLEANER has a high evaporation rate to make screens ready for use quickly and without the need for a water rinse.
-
LevelCote™ Flux 350
LEVELCOTE FLUX 350 is a unique blend of ingredients formulated for use in a horizontal hot air leveling process. It will remove light copper oxides and lays down a protective layer of flux to protect solder mask, and promote good solderability of copper pads. LEVELCOTE FLUX 350 will provide a bright uniform solder finish with good rinseability. LEVELCOTE FLUX 350 is non-foaming and compatible with LPI and dry film solder masks.
-
CuBrite™ PC-525
A copper plating additive for acid sulfate plating baths designed specifically for high throwing power through-hole plating of printed circuit boards. CuBrite PC-525 produces bright copper deposits that provide consistent thermal stress performance. CuBrite PC-525 is a single, clear addition agent, added on an ampere hour basis, which is used to control the brightness and physical properties of the deposit. The extreme stability of this additive greatly reduces the need for routine solution purification.
