MicroClean™ S
MicroClean S is a low foam cleaner for removing fingerprints, chromate and oxide residues from copper and other metal foils prior to photoresist lamination or oxide.
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MicroClean S is a low foam cleaner for removing fingerprints, chromate and oxide residues from copper and other metal foils prior to photoresist lamination or oxide.
A safe solvent based material for the removal of uncured printing inks and solder masks. It contains no chlorinated hydrocarbons and no flammable solvents. DPC-20 SCREEN CLEANER is fast acting and has high holding capacity for economy and higher productivity.
Defoamer FETM is a fully organic non-Silicone water-soluble defoamer that rinses readily and leaves no residue. It is designed for systems where clean rinsing is essential. It is odorfree and biodegradable. Defoamer FETM is ideal for defoaming developers or strippers of any type and will work at any pH.
Ferric Defoamer is a fully organic, non-silicone, water-soluble defoamer that rinses readily and leaves no residue. It is designed for systems where clean rinsing is essential. It is odor-free and biodegradable. Ferric Defoamer is ideal for defoaming ferric chloride and ferric nitrate etchants. Ferric Defoamer is a powerful but application specific defoamer, which works well only at certain temperatures and in concentrated etchants.
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