MicroClean™ S
MicroClean S is a low foam cleaner for removing fingerprints, chromate and oxide residues from copper and other metal foils prior to photoresist lamination or oxide.
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Layer Clean™ CR
An acid, non-etching cleaner that provides the most effective removal of chromate conversion coating from copper laminate. LAYER CLEAN CR also removes soils such as fingerprints and oxides. Used prior to photoresist lamination, it reduces imaging defects by improving photoresist adhesion. LAYER CLEAN CR’s non-chelating, non-chloride formula cleans and conditions copper surfaces, and provides consistent high speed cleaning at low concentrations. It is effective in both spray and soak applications.
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Layer Clean™ NP
An acid, non-etching cleaner that provides the most effective removal of chromate conversion coating from copper laminate. LAYER CLEAN NP also removes soils such as fingerprints and oxides. Used prior to photoresist lamination, it reduces imaging defects by improving photoresist adhesion. LAYER CLEAN NP’s non-chelating, non-chloride, phosphate free formula cleans and conditions copper surfaces, and provides consistent high speed cleaning at low concentrations. It is effective in both spray and soak applications.
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Ferric Defoamer™
Ferric Defoamer is a fully organic, non-silicone, water-soluble defoamer that rinses readily and leaves no residue. It is designed for systems where clean rinsing is essential. It is odor-free and biodegradable. Ferric Defoamer is ideal for defoaming ferric chloride and ferric nitrate etchants. Ferric Defoamer is a powerful but application specific defoamer, which works well only at certain temperatures and in concentrated etchants.
