MicroClean™ S
MicroClean S is a low foam cleaner for removing fingerprints, chromate and oxide residues from copper and other metal foils prior to photoresist lamination or oxide.
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LevelCote™ Cover Oil 300
LEVELCOTE COVER OIL 300 is formulated for use as a solder blanket oil for horizontal hot air leveling equipment. It prevents the formation of dross by eliminating contact of oxygen to molten solder. When used un a recirculation or oil injection system, LEVELCOTE COVER OIL 300 will lubricate pumps and internal transport mechanisms of horizontal hot air leveling equipment, reducing solder webbing.
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MicroClean™ CM
MicroClean™ CM is a “micro-cleaner” that is designed to remove extremely tenacious soils from copper, iron, iron-nickel and iron-nickel-chrome alloys. MicroClean™ CM was created to meet the needs of the Chemical Milling Industry. It can remove even baked-on organic compounds, such as may be found on sheets of Alloy 42, stainless steels or copper as they are received or after stripping baked-on photoresist.
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ChemPolish™ ET
ChemPolish ET (RDX-1096)is an acidic bath used for polishing and passivating 300 series (austenitic) stainless steel as well as other alloys such as Alloy 42 (Kovar). Chemically polished surfaces are suitable for use in extreme environments including high vacuum, medical and aerospace applications. ChemPolish ET (RDX-1096)leaves a clean finish, free of etching,hydrogen embrittlement or halide induced stress cracking. Metal is removed preferentially from high points resulting in a smoother, more leveled surface. The surface is cleaned completely of any organic contamination and is free of soluble inorganic residues.
