MicroClean™ S
MicroClean S is a low foam cleaner for removing fingerprints, chromate and oxide residues from copper and other metal foils prior to photoresist lamination or oxide.
Download Data Sheets
Download Data Sheets
MicroClean S is a low foam cleaner for removing fingerprints, chromate and oxide residues from copper and other metal foils prior to photoresist lamination or oxide.
MicroClean CuLX is a micro-cleaner that is designed to remove extremely tenacious soils from copper
MicroClean CuL is a micro-cleaner that is designed to remove extremely tenacious soils from copper
Ferric Cleaner removes water hardness, photoresist scum and metal salt deposits from chemical processing equipment. Specifically developed for the chemical milling industry it is very useful in spray equipment causing no damage to metal and plastic parts. It can be applied in ferric etchers, dry film developers, strippers and cleaner equipment modules.
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