Aqua Flo
An organic, water soluble fusing fluid custom blended for use in tin/lead infrared fusing equipment. AQUA FLOcontains activators which clean exposed copper, providing excellent edge coverage.
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D-4000™ Liquid Developer
A one-part concentrate (40% potassium carbonate) formulated to develop fully aqueous Riston® photopolymer films. D-4000 is economical to use and easy to handle, eliminating the need to weigh and dissolve powdered materials. It is formulated to give optimum results with DuPont™ Riston® films and FoamFREE™ defoamers in conveyorized spray developer equipment.
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ADF-30
A photoresist stripper formulated to remove a wide variety of aqueous photoresists. ADF-30provides fast strip speeds and contains brightening and antitarnish agents for a uniform copper surface for automatic optical inspection and better etching characteristics. It produces filterable particles and contains no glycol ethers for a safer working environment. Effective in soak or spray applications.
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HASL Precleaner SL™
HASL Precleaner SLTM is a powerful, non-foaming, free rinsing, alkaline cleaner specifically designed to clean copper prior to HASL or alternative finishes. It will remove solder mask developer scum, oven baked oxidation and residues, fingerprints, and oils. HASL Precleaner SLTM will not etch copper nor will it damage the. HASL Precleaner SLTM can be used in conjunction with a light microetch or acid cleaner. If an acid cleaner is used, MicroCleanTM ZE is preferred. If a microetch is used, much lower levels of metal removal are fully acceptable, thus minimizing costs and reject rate. Because of the potent cleaning agents that destroy organo-metallic compounds (such as insoluble copper/soldermask compounds) present on the copper surfaces, use of HASL Precleaner SLTM will reduce the requirement for a second pass through the HASL.
