MicroClean™ CuL
MicroClean CuL is a micro-cleaner that is designed to remove extremely tenacious soils from copper
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Download Data Sheets
MicroClean CuL is a micro-cleaner that is designed to remove extremely tenacious soils from copper
MicroClean S is a low foam cleaner for removing fingerprints, chromate and oxide residues from copper and other metal foils prior to photoresist lamination or oxide.
ChemPolish RD-5is an acidic bath used for polishing and passivating 300 series (austenitic) stainless steel as well as other alloys such as Alloy 42 (Kovar). Chemically polished surfaces are suitable for use in extreme environments including high vacuum, medical and aerospace applications. ChemPolish RD-5 leaves a clean finish, free of etching, hydrogen embrittlement or halide induced stress cracking. Metal is removed preferentially from high points resulting in a smoother, more leveled surface. The surface is cleaned completely of any organic contamination and is free of soluble inorganic residues.
Ferric Cleaner removes water hardness, photoresist scum and metal salt deposits from chemical processing equipment. Specifically developed for the chemical milling industry it is very useful in spray equipment causing no damage to metal and plastic parts. It can be applied in ferric etchers, dry film developers, strippers and cleaner equipment modules.
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