ResiStrip™ PC
ResiStrip PCis designed to strip photoresist quickly and economically operating at low pH. It will tend to give smaller particle sizes.
Download Data Sheets
Download Data Sheets
ResiStrip PCis designed to strip photoresist quickly and economically operating at low pH. It will tend to give smaller particle sizes.
An organic, water soluble fusing fluid custom blended for use in tin/lead infrared fusing equipment. AQUA FLOcontains activators which clean exposed copper, providing excellent edge coverage.
An acid, sprayable cleaner and microetch. SUR CLEAN 92 removes a minute portion of metallic copper in addition to oxides and organic contamination. It can be used for cleaning inner layers, prior to solder mask application for SMOBC, and prior to solder leveling. It is effective in both spray and soak applications.
Low acid activator system used to catalyze non-metallic surfaces for the subsequent metallization by electroless copper. CIRCUTEK C-777is primarily used in the fabrication of printed circuit boards but can also be used in any application where the metallization of a non-conductor is desired.A pre-dip solution is necessary to pre condition the substrate and to minimize drag-in of water into the CIRCUTEK C-777. Make up the pre-dip solution according to instructions below, or use CIRCUITEK PD-776 liquid.CIRCUTEK PD-776Sis also used in the preparation of CIRCUTEK C-777.
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