ResiStrip™ PC
ResiStrip PCis designed to strip photoresist quickly and economically operating at low pH. It will tend to give smaller particle sizes.
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ResiStrip™ 5000
ResiStrip 5000 is designed to strip difficult to remove photoresists and LDI films quickly, thoroughly and economically. The stripped board is oxidation-free and ready for oxide or etching.
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ResiStrip™ VI
ResiStrip VI is designed to address the chemical milling industry’s requirements for a fast and cost effective stripper for Copper, Alloy 42, and stainless steel. ResiStrip VI strips thoroughly and quickly, while costing a fraction of conventional proprietary stripping systems. ResiStrip VI leaves copper in a bright, tarnish free condition and will remove any staining of stainless steel from the photoresist. ResiStrip VI gives a small stripped particle size.
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Circutek C-777
Low acid activator system used to catalyze non-metallic surfaces for the subsequent metallization by electroless copper. CIRCUTEK C-777is primarily used in the fabrication of printed circuit boards but can also be used in any application where the metallization of a non-conductor is desired.A pre-dip solution is necessary to pre condition the substrate and to minimize drag-in of water into the CIRCUTEK C-777. Make up the pre-dip solution according to instructions below, or use CIRCUITEK PD-776 liquid.CIRCUTEK PD-776Sis also used in the preparation of CIRCUTEK C-777.
