ResiStrip™ PC
ResiStrip PCis designed to strip photoresist quickly and economically operating at low pH. It will tend to give smaller particle sizes.
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ResiStrip™ VI
ResiStrip VI is designed to address the chemical milling industry’s requirements for a fast and cost effective stripper for Copper, Alloy 42, and stainless steel. ResiStrip VI strips thoroughly and quickly, while costing a fraction of conventional proprietary stripping systems. ResiStrip VI leaves copper in a bright, tarnish free condition and will remove any staining of stainless steel from the photoresist. ResiStrip VI gives a small stripped particle size.
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ADF-35
Formulated to remove fully aqueous dry films and screen ink resists from inner layers in spray applications. ADF-35will produce large particles for easy filtration, with less dissolved resist for prolonged bath life. It contains antitarnish agents to maintain a bright uniform copper appearance. It has very low levels of ingredients classified as VOCs, and when used as directed is exempt from SCAQMDregulation.
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Solder Conditioner II™
Solder Conditioner IITMis a concentrated solutionformulated to clean tin and tin/lead deposits on printed circuit boards. Solder Conditioner IITMremoves oxides caused by copper etchants but will not etch copper or tin/lead deposits. Printed circuit boards treated with Solder Conditioner IITMhave exceptional solderability and will reflow readily.Treated boards may go directly to reflow or into immersion tin prior to reflow. Solder Conditioner IITMcan replace immersion tin in certain applications.
