ResiStrip™ PC
ResiStrip PCis designed to strip photoresist quickly and economically operating at low pH. It will tend to give smaller particle sizes.
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Download Data Sheets
ResiStrip PCis designed to strip photoresist quickly and economically operating at low pH. It will tend to give smaller particle sizes.
FlexClean DM is a powerful, non-foaming and free rinsing alkaline cleaner specifically formulated to clean copper on exposed alkalisensitive substrates including polyimide. It will remove oven baked residues, oxidation, fingerprints and oils, all without attack of alkali sensitive substrates or removal of any copper metal. Use of FlexClean DM will leave the copper surface bright, oxidation-free and ready for photoresist application or oxide process. FlexClean DM may be used in conjunction with an acid cleaner, or if required, a light microetch. If a microetch is used, much lower levels of metal are fully acceptable thus minimizing costs and reject rate.
An organic, water soluble fusing fluid custom blended for use in tin/lead infrared fusing equipment. AQUA FLOcontains activators which clean exposed copper, providing excellent edge coverage.
An acid, sprayable cleaner and microetch. SUR CLEAN 92 removes a minute portion of metallic copper in addition to oxides and organic contamination. It can be used for cleaning inner layers, prior to solder mask application for SMOBC, and prior to solder leveling. It is effective in both spray and soak applications.
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