MAGNUM S-450 is used to condition holes after drilling and before the desmear step in preparation for metallization. It is effective on a variety of resin materials including epoxy and polyimide and is replenishable. MAGNUM S-450 does not require circuit boards to be dried prior to processing.
MAGNUM S-450 is designed to be used in conjunction with MAGNUM K-OXIDIZER and MAGNUM N-OXIDIZER for the desmear and etchback of multilayer circuit boards. It is designed for use with high Tg, and high performance resin materials including polyimide.
MAGNUM S-450 provides the fabricator with wide process latitude with respect to penetrating and swelling a wide variety of materials. The process is a two -part system, allowing the fabricator to have the flexibility of processing mixed resin material builds, including lead-free and low Dk, low Df resins.
RBP Chemical Technology is a leading supplier of proprietary chemicals for printed circuit fabrication and semiconductor test applications. RBP’s chemical formulas are tailored to meet the precise needs and requirements for advanced circuit boards, primarily in aerospace, medical and military applications. Headquartered in Milwaukee, Wisconsin and expanding globally, RBP is certified to ISO 9001:2015 and is the Intelligent Choice for the electronics industry.