Mike Carano, RBP Vice President of Technology and Business Development leads a webinar to provide an overview of key technical issues driving changes in circuit board design and fabrication, including board thickness and HDI; line width and spaces, via structure and other measurements being driven by the trend toward miniaturization; trends in materials; printed electronics; and today’s biggest technical challenges.
Looking to outsource your chemical manufacturing or blending? Catch up on latest webinar.
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