Onyx
Graphite Based Direct Metallization for Printed Circuit Boards. Onyx is a process in which a proprietary graphite dispersion is used to impart electrical conductivity on through holes and vias of printed circuit boards. This process prepares the board for copper electroplating in a similar way electroless copper process does but with the benefits of simplicity and environmental friendliness. Onyx consists of a short sequence of chemical steps that include conditioning with Onyx CC, graphite application with Onyx DM and leveling with Onyx LV.
Download Data Sheets
Related products
-
Dual Strip™ BAT
Formulated to remove fully aqueous dry films and screen ink resists in soak or spray applications. DUAL STRIP will generally break dry films into particles suitable for filtration. DUAL STRIP has a low VOC content for reduced air emissions. DUAL STRIP BAT contains additional copper brightening and antitarnish agents that produce a bright, uniform copper surface for automatic optical inspection and better etching characteristics.
-
Magnum™ GE-600
A non-ammoniated fluoride glass etch. MAGNUM GE-600 is used to etch away the glass fiber bundles left exposed after the permanganate etchback process. It can be mixed with MAGNUM N-599 NEUTRALIZER or used as a separate step for maximum process control.
-
DX™ Strip BAT
Provides additional antitarnish protection while removing fully aqueous liquid photoresists in spray or soak applications. DX STRIP BAT is also effective on aqueous dry film photoresists, and on a combination of liquid and dry film resists being stripped in the same process. It will generally break dry films into particles suitable for filtration. DX STRIP BAT has a low VOC content for reduced air emissions.
