Circutek PC-701
A high speed, electroless copper process which is capable of depositing 80 -100 millionths of copper in 30 minutes. CIRCUTEK PC-701 deposits a dense, adherent copper film on catalyzed surfaces for the production of printed circuit boards.The solution is easy to control and has a broad operating temperature range. The copper produced is a bright pink, fine-grained deposit, which is readily receptive to subsequent copper electrodeposition.
Download Data Sheets
Related products
-
FoamFREE™ One
A silicone free, non-solvent based aqueous antifoam for primary image developers and strippers and solder mask developers. FoamFREE™ONE suppresses foaming at very low usage without leaving residue behind or in the machine. FoamFREE™ONE is for any manufacturer who needs to reduce antifoam usage to reduce process costs without the use of solvents
-
Layer Clean™ NP
An acid, non-etching cleaner that provides the most effective removal of chromate conversion coating from copper laminate. LAYER CLEAN NP also removes soils such as fingerprints and oxides. Used prior to photoresist lamination, it reduces imaging defects by improving photoresist adhesion. LAYER CLEAN NP’s non-chelating, non-chloride, phosphate free formula cleans and conditions copper surfaces, and provides consistent high speed cleaning at low concentrations. It is effective in both spray and soak applications.
-
LevelCote™ Cover Oil 300
LEVELCOTE COVER OIL 300 is formulated for use as a solder blanket oil for horizontal hot air leveling equipment. It prevents the formation of dross by eliminating contact of oxygen to molten solder. When used un a recirculation or oil injection system, LEVELCOTE COVER OIL 300 will lubricate pumps and internal transport mechanisms of horizontal hot air leveling equipment, reducing solder webbing.

