Circutek PC-801
A high speed, electroless copper process which is capable of depositing 80 -100 millionths of copper in 30 minutes. CIRCUTEK PC-801 deposits a dense, adherent copper film on catalyzed surfaces for the production of printed circuitboards.The solution is easy to control and has a broad operating temperature range. The copper produced is a bright pink, fine-grained deposit, which is readily receptive to subsequent copper electrodeposition.
Download Data Sheets
Related products
-
Dual Strip™ BAT
Formulated to remove fully aqueous dry films and screen ink resists in soak or spray applications. DUAL STRIP will generally break dry films into particles suitable for filtration. DUAL STRIP has a low VOC content for reduced air emissions. DUAL STRIP BAT contains additional copper brightening and antitarnish agents that produce a bright, uniform copper surface for automatic optical inspection and better etching characteristics.
-
Flo Rite™ 60
FLO RITE 60 is a unique blend of ingredients for use in a horizontal and vertical hot air leveling process. FLO RITE 60 will remove light copper oxides and lays down a protective layer of flux to protect soldermask and promote good solderability of copper pads. FLO RITE 60 will provide a bright uniform finish with good rinsability. FLO RITE 60 is a solvent free, non-foaming flux that is compatible with LPI and dry film soldermasks.
-
FoamFREE™ One
A silicone free, non-solvent based aqueous antifoam for primary image developers and strippers and solder mask developers. FoamFREE™ONE suppresses foaming at very low usage without leaving residue behind or in the machine. FoamFREE™ONE is for any manufacturer who needs to reduce antifoam usage to reduce process costs without the use of solvents