Circutek PD-776
Pre-dip solution used in conjunction with CIRCUTEK C-777activator in catalyzing the substrate for subsequent electroless copper deposition. CIRCUTEK PD-776replaces the hydrochloric acid and water normally used in the step prior to the activator and in the activator solution itself.
Download Data Sheets
Related products
-
EV Screen Cleaner™
A wipe-off screen cleaner formulated to rapidly remove inks from printed circuit screens and boards without leaving a residue. EV SCREEN CLEANER has a high evaporation rate to make screens ready for use quickly and without the need for a water rinse.
-
LevelCote™ Flux 350
LEVELCOTE FLUX 350 is a unique blend of ingredients formulated for use in a horizontal hot air leveling process. It will remove light copper oxides and lays down a protective layer of flux to protect solder mask, and promote good solderability of copper pads. LEVELCOTE FLUX 350 will provide a bright uniform solder finish with good rinseability. LEVELCOTE FLUX 350 is non-foaming and compatible with LPI and dry film solder masks.
-
DX™45 HW
A liquid 45% potassium carbonate concentrate formulated to develop fully aqueous dry film photoresists and photoimageable solder masks. DX-45 HW contains a unique blend of ingredients to ensure straight sidewalls and will help clean the foot” of underdeveloped polymer. Furthermore
