Circutek PD-776
Pre-dip solution used in conjunction with CIRCUTEK C-777activator in catalyzing the substrate for subsequent electroless copper deposition. CIRCUTEK PD-776replaces the hydrochloric acid and water normally used in the step prior to the activator and in the activator solution itself.
Download Data Sheets
Related products
-
DPC-20 Screen Cleaner™
A safe solvent based material for the removal of uncured printing inks and solder masks. It contains no chlorinated hydrocarbons and no flammable solvents. DPC-20 SCREEN CLEANER is fast acting and has high holding capacity for economy and higher productivity.
-
Equipment Cleaner II™
Equipment Cleaner II removes water hardness, photoresist and soldermask scum and metal salt deposits from chemical processing equipment. Specifically developed for the Printed Circuit Board and Chemical Milling Industries, it will safely clean any spray equipment without damage to any metal or plastic. Equipment Cleaner II may be used at any temperature the equipment can safely handle, and may be reused until all the capacity is consumed. Equipment Cleaner II is a product that cleans: • Dry film developer residues • Dry film stripper residues • Solder stripper residues • Cleaner residues • Etcher residues (ammoniacal, or cupric) • Soldermask Developer residue • Tin Stripper Iron residue
-
MagnaBond™ CO-300
A copper oxide process uniquely formulated to produce a variety of oxide coatings ranging from a very fine-grained bronzed oxide to a larger grained black oxide. MAGNABOND CO-300 provides the flexibility to manipulate the grain size allowing for processing a wide variety of dielectric materials while maintaining optimum inner-layer bonding.
