Hydrochloric Acid 20 Be
HydrochloricAcid 20Be is used in Step Four: Inner Layer Etching. This product should be used only for its intended purpose.
Download Data Sheets
Download Data Sheets
HydrochloricAcid 20Be is used in Step Four: Inner Layer Etching. This product should be used only for its intended purpose.
A safe solvent based material for the removal of uncured printing inks and solder masks. It contains no chlorinated hydrocarbons and no flammable solvents. DPC-20 SCREEN CLEANER is fast acting and has high holding capacity for economy and higher productivity.
An acid, non-etching cleaner that provides the most effective removal of chromate conversion coating from copper laminate. LAYER CLEAN NP also removes soils such as fingerprints and oxides. Used prior to photoresist lamination, it reduces imaging defects by improving photoresist adhesion. LAYER CLEAN NP’s non-chelating, non-chloride, phosphate free formula cleans and conditions copper surfaces, and provides consistent high speed cleaning at low concentrations. It is effective in both spray and soak applications.
A liquid 45% potassium carbonate concentrate formulated to develop fully aqueous dry film photoresists and photoimageable solder masks. DX-45 HW contains a unique blend of ingredients to ensure straight sidewalls and will help clean the foot” of underdeveloped polymer. Furthermore
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