Magnum N-499
Magnum N-499 removes (neutralizes) the residue left on the hole walls following the permanganate desmear/etchback process. It utilizes the “peroxide” chemistry.
Download Data Sheets
Download Data Sheets
Magnum N-499 removes (neutralizes) the residue left on the hole walls following the permanganate desmear/etchback process. It utilizes the “peroxide” chemistry.
An acidic, solvent-based, soluble equipment cleaner designed for use on photoresist developers and strippers. E-cleanDF is exceptionally effective on dry film resists, antifoam residues, hard water scale and carbonate residues. It effectively cleans the residues inside nozzles and pipes.
De-Ox II is a de-oxidizer that will remove tin, lead oxides as well as other oxides from contact surfaces minimizing resistance levels and restoring semiconductor test sockets to optimal performance. De-Ox II deoxidizes without “activating” the metal surface therefore subsequent re-growth of oxides is not altered. De-Ox II removes only oxides, and will not attack most metals, except zinc and aluminum. De-Ox II does not attack plastic surfaces in test sockets.
A liquid 45% potassium carbonate concentrate formulated to develop fully aqueous dry film photoresists and photoimageable solder masks. DX-45 NH contains a unique blend of ingredients to ensure straight sidewalls and will help clean the foot” of underdeveloped polymer. These same ingredients help keep the equipment clean
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