Magnum N-499
Magnum N-499 removes (neutralizes) the residue left on the hole walls following the permanganate desmear/etchback process. It utilizes the “peroxide” chemistry.
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Download Data Sheets
Magnum N-499 removes (neutralizes) the residue left on the hole walls following the permanganate desmear/etchback process. It utilizes the “peroxide” chemistry.
Equipment Cleaner II removes water hardness, photoresist and soldermask scum and metal salt deposits from chemical processing equipment. Specifically developed for the Printed Circuit Board and Chemical Milling Industries, it will safely clean any spray equipment without damage to any metal or plastic. Equipment Cleaner II may be used at any temperature the equipment can safely handle, and may be reused until all the capacity is consumed. Equipment Cleaner II is a product that cleans: • Dry film developer residues • Dry film stripper residues • Solder stripper residues • Cleaner residues • Etcher residues (ammoniacal, or cupric) • Soldermask Developer residue • Tin Stripper Iron residue
De-Ox II is a de-oxidizer that will remove tin, lead oxides as well as other oxides from contact surfaces minimizing resistance levels and restoring semiconductor test sockets to optimal performance. De-Ox II deoxidizes without “activating” the metal surface therefore subsequent re-growth of oxides is not altered. De-Ox II removes only oxides, and will not attack most metals, except zinc and aluminum. De-Ox II does not attack plastic surfaces in test sockets.
An acid, non-etching cleaner that provides the most effective removal of chromate conversion coating from copper laminate. LAYER CLEAN NP also removes soils such as fingerprints and oxides. Used prior to photoresist lamination, it reduces imaging defects by improving photoresist adhesion. LAYER CLEAN NP’s non-chelating, non-chloride, phosphate free formula cleans and conditions copper surfaces, and provides consistent high speed cleaning at low concentrations. It is effective in both spray and soak applications.
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