Screensol™ SC-55
An economical, solvent based screen wash formulated to remove solvent processible inks from printed circuits screens and boards without leaving residue.
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An economical, solvent based screen wash formulated to remove solvent processible inks from printed circuits screens and boards without leaving residue.
LEVELCOTE FLUX 350 is a unique blend of ingredients formulated for use in a horizontal hot air leveling process. It will remove light copper oxides and lays down a protective layer of flux to protect solder mask, and promote good solderability of copper pads. LEVELCOTE FLUX 350 will provide a bright uniform solder finish with good rinseability. LEVELCOTE FLUX 350 is non-foaming and compatible with LPI and dry film solder masks.
A copper plating additive for acid sulfate plating baths designed specifically for high throwing power through-hole plating of printed circuit boards. CuBrite PC-525 produces bright copper deposits that provide consistent thermal stress performance. CuBrite PC-525 is a single, clear addition agent, added on an ampere hour basis, which is used to control the brightness and physical properties of the deposit. The extreme stability of this additive greatly reduces the need for routine solution purification.
LEVELCOTE COVER OIL 300 is formulated for use as a solder blanket oil for horizontal hot air leveling equipment. It prevents the formation of dross by eliminating contact of oxygen to molten solder. When used un a recirculation or oil injection system, LEVELCOTE COVER OIL 300 will lubricate pumps and internal transport mechanisms of horizontal hot air leveling equipment, reducing solder webbing.
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