Circutek CC-710
An alkaline solution to prepare and condition printed circuit boards for through-hole metallization. CIRCUTEK CC-710is specially formulated to remove fingerprints, light soil and other contaminates from copper foil. It also conditions hard to catalyze surfaces such as organic resin and glass for subsequent electroless copper deposition. CIRCUTEK CC-710is supplied as a liquid concentrate.
Download Data Sheets
Related products
-
Flo Rite™ 60
FLO RITE 60 is a unique blend of ingredients for use in a horizontal and vertical hot air leveling process. FLO RITE 60 will remove light copper oxides and lays down a protective layer of flux to protect soldermask and promote good solderability of copper pads. FLO RITE 60 will provide a bright uniform finish with good rinsability. FLO RITE 60 is a solvent free, non-foaming flux that is compatible with LPI and dry film soldermasks.
-
De-Ox™ II
De-Ox II is a de-oxidizer that will remove tin, lead oxides as well as other oxides from contact surfaces minimizing resistance levels and restoring semiconductor test sockets to optimal performance. De-Ox II deoxidizes without “activating” the metal surface therefore subsequent re-growth of oxides is not altered. De-Ox II removes only oxides, and will not attack most metals, except zinc and aluminum. De-Ox II does not attack plastic surfaces in test sockets.
-
DX™45 HW
A liquid 45% potassium carbonate concentrate formulated to develop fully aqueous dry film photoresists and photoimageable solder masks. DX-45 HW contains a unique blend of ingredients to ensure straight sidewalls and will help clean the foot” of underdeveloped polymer. Furthermore