Circutek™ ME-515
A powdered material that is mixed with water and sulfuric acid to make a mild etch solution for copper and copper alloys. The operating solution provides a bright, clean, uniformly etched copper surface on printed circuit boards. CIRCUTEK ME-515 operating solution is specially formulated to be used in place of a sulfuric/peroxide or sodium or ammonium persulfate etching solution. It is excellent for removing tarnish and oxidation from the copper surface, and can be used prior to electroless and electrolytic plating, after tab stripping.
When used prior to electrolytic plating as part of a pattern cleaning system, CIRCUTEK ME-515 cleans and etches copper surfaces. It aids in the removal of dry film binder residues that penetrate into the copper-clad surface of printed circuit boards.
Download Data Sheets
Related products
-
Dual Strip™ BAT
Formulated to remove fully aqueous dry films and screen ink resists in soak or spray applications. DUAL STRIP will generally break dry films into particles suitable for filtration. DUAL STRIP has a low VOC content for reduced air emissions. DUAL STRIP BAT contains additional copper brightening and antitarnish agents that produce a bright, uniform copper surface for automatic optical inspection and better etching characteristics.
-
FinClean RS
FinClean RS is a final finish acid cleaner designed for soak application and developed for use with immersion silver, OSP and other finishes. It is characterized by a relatively weaker acidity with excellent detergency and thus cleaning performance. Its formulation does not include chloride and is biodegradable.
-
DX™ Strip BAT
Provides additional antitarnish protection while removing fully aqueous liquid photoresists in spray or soak applications. DX STRIP BAT is also effective on aqueous dry film photoresists, and on a combination of liquid and dry film resists being stripped in the same process. It will generally break dry films into particles suitable for filtration. DX STRIP BAT has a low VOC content for reduced air emissions.
