Magnum N-499 Peroxide
Magnum N-499 Peroxide is a stabilized 25% hydrogen peroxide solution. It is designed for use in preparation and replenishment of Magnum N-499.
Download Data Sheets
Download Data Sheets
Magnum N-499 Peroxide is a stabilized 25% hydrogen peroxide solution. It is designed for use in preparation and replenishment of Magnum N-499.
De-Ox II is a de-oxidizer that will remove tin, lead oxides as well as other oxides from contact surfaces minimizing resistance levels and restoring semiconductor test sockets to optimal performance. De-Ox II deoxidizes without “activating” the metal surface therefore subsequent re-growth of oxides is not altered. De-Ox II removes only oxides, and will not attack most metals, except zinc and aluminum. De-Ox II does not attack plastic surfaces in test sockets.
A copper plating additive for acid sulfate plating baths designed specifically for high throwing power through-hole plating of printed circuit boards. CuBrite PC-525 produces bright copper deposits that provide consistent thermal stress performance. CuBrite PC-525 is a single, clear addition agent, added on an ampere hour basis, which is used to control the brightness and physical properties of the deposit. The extreme stability of this additive greatly reduces the need for routine solution purification.
A copper oxide process uniquely formulated to produce a variety of oxide coatings ranging from a very fine-grained bronzed oxide to a larger grained black oxide. MAGNABOND CO-300 provides the flexibility to manipulate the grain size allowing for processing a wide variety of dielectric materials while maintaining optimum inner-layer bonding.
Looking to outsource your chemical manufacturing or blending? Catch up on latest webinar.
|