Sodium Chlorate 46%
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LevelCote™ Flux 350
LEVELCOTE FLUX 350 is a unique blend of ingredients formulated for use in a horizontal hot air leveling process. It will remove light copper oxides and lays down a protective layer of flux to protect solder mask, and promote good solderability of copper pads. LEVELCOTE FLUX 350 will provide a bright uniform solder finish with good rinseability. LEVELCOTE FLUX 350 is non-foaming and compatible with LPI and dry film solder masks.
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MagnaBond™ CO-300
A copper oxide process uniquely formulated to produce a variety of oxide coatings ranging from a very fine-grained bronzed oxide to a larger grained black oxide. MAGNABOND CO-300 provides the flexibility to manipulate the grain size allowing for processing a wide variety of dielectric materials while maintaining optimum inner-layer bonding.
