Circutek A-778
An acidic liquid concentrate which modifies palladium catalyzed surfaces for subsequent deposition of electroless copper. CIRCUTEK A-778produces a highly active surface for initiating rapid copper deposition while protecting the electroless copper bath from drag in contamination from the activator solution.
Download Data Sheets
Related products
-
De-Ox™
De-Ox is a de-oxidizer that will remove tin, lead oxides as well as other oxides from contact surfaces minimizing resistance levels and restoring semiconductor test sockets to optimal performance. De-Ox deoxidizes without “activating” the metal surface therefore subsequent re-growth of oxides is not altered. De-Ox removes only oxides, and will not attack most metals, except zinc and aluminum.
-
DX™45 Plus
A one-part concentrate formulated to develop fully aqueous dry film photoresists and photoimageable solder masks. DX-45 PLUS’ highly concentrated formula is ideally suited for use in feed and bleed systems, resulting in less frequent additions than with more dilute carbonate solutions. Proprietary ingredients enhance loading, help keep equipment clean, and ensure straighter sidewalls, cleaning the foot” of underdeveloped resist. These features result in greater productivity and less down time. “” one-part concentrate formulated to develop fully aqueous dry film photoresists and photoimageable”
-
CuBrite™ PC-525
A copper plating additive for acid sulfate plating baths designed specifically for high throwing power through-hole plating of printed circuit boards. CuBrite PC-525 produces bright copper deposits that provide consistent thermal stress performance. CuBrite PC-525 is a single, clear addition agent, added on an ampere hour basis, which is used to control the brightness and physical properties of the deposit. The extreme stability of this additive greatly reduces the need for routine solution purification.