Circutek A-778
An acidic liquid concentrate which modifies palladium catalyzed surfaces for subsequent deposition of electroless copper. CIRCUTEK A-778produces a highly active surface for initiating rapid copper deposition while protecting the electroless copper bath from drag in contamination from the activator solution.
Download Data Sheets
Related products
-
LevelCote™ Cover Oil 300
LEVELCOTE COVER OIL 300 is formulated for use as a solder blanket oil for horizontal hot air leveling equipment. It prevents the formation of dross by eliminating contact of oxygen to molten solder. When used un a recirculation or oil injection system, LEVELCOTE COVER OIL 300 will lubricate pumps and internal transport mechanisms of horizontal hot air leveling equipment, reducing solder webbing.
-
Equipment Cleaner II™
Equipment Cleaner II removes water hardness, photoresist and soldermask scum and metal salt deposits from chemical processing equipment. Specifically developed for the Printed Circuit Board and Chemical Milling Industries, it will safely clean any spray equipment without damage to any metal or plastic. Equipment Cleaner II may be used at any temperature the equipment can safely handle, and may be reused until all the capacity is consumed. Equipment Cleaner II is a product that cleans: • Dry film developer residues • Dry film stripper residues • Solder stripper residues • Cleaner residues • Etcher residues (ammoniacal, or cupric) • Soldermask Developer residue • Tin Stripper Iron residue
-
Defoamer FE™
Defoamer FETM is a fully organic non-Silicone water-soluble defoamer that rinses readily and leaves no residue. It is designed for systems where clean rinsing is essential. It is odorfree and biodegradable. Defoamer FETM is ideal for defoaming developers or strippers of any type and will work at any pH.
