Circutek C-877
Circutek C-877 is used to catalyze non-metallic surfaces in the electroless copper process. Such surfaces are present in drilled holes (PTH) and include resin and glass weave surfaces that were cleaned and exposed in the desmear process steps. The chemical activity relies on the presence of colloidal palladium, which when adsorbed on non-metallic surfaces enables plating of electroless copper deposits. Circutek C-877 bath must be preceded by Circutek PD-776 to protect the delicate chemical balance of the former and assure the optimal catalyst performance.
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