Rinse Aide™ 95
Formulated for removing insoluble flux residues and ionic contaminants from printed circuit boards following leveling or fusing. RINSE AIDE 95 is designed to be used in spray equipment.
Download Data Sheets
Download Data Sheets
Formulated for removing insoluble flux residues and ionic contaminants from printed circuit boards following leveling or fusing. RINSE AIDE 95 is designed to be used in spray equipment.
An acid, non-etching cleaner that provides the most effective removal of chromate conversion coating from copper laminate. LAYER CLEAN CR also removes soils such as fingerprints and oxides. Used prior to photoresist lamination, it reduces imaging defects by improving photoresist adhesion. LAYER CLEAN CR’s non-chelating, non-chloride formula cleans and conditions copper surfaces, and provides consistent high speed cleaning at low concentrations. It is effective in both spray and soak applications.
A non-ammoniated fluoride glass etch. MAGNUM GE-600 is used to etch away the glass fiber bundles left exposed after the permanganate etchback process. It can be mixed with MAGNUM N-599 NEUTRALIZER or used as a separate step for maximum process control.
A wipe-off screen cleaner formulated to rapidly remove inks from printed circuit screens and boards without leaving a residue. EV SCREEN CLEANER has a high evaporation rate to make screens ready for use quickly and without the need for a water rinse.
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